The immediate challenges faced by the silicon sector constitute reducing time-to-market and partnering with competent manufacturers.
With sub micron technology capabilities and core design expertise, Wipro addresses these challenges effectively.
Our efforts are focused on developing a workflow to optimize productivity of post GDS activities and offer cost efficiency to the customer. Our solutions are enabled through our extensive industry knowledge and precious partnerships with manufacturing vendors. Our solution offerings are:
Cost Reduction
We help reduce costs by:
- Accessing top-of-the-line tool flow and libraries from third party EDA/library vendors leading to reduced die size
- Minimizing test times with parallel and multi-site testing
- Cost-efficient manufacturing alternatives from foundry and package partnerships
- Aggregating multiple customer projects by directly utilizing manufacturing partners, foundry and assembly vendors
End to End Ownership
We deliver high-quality product-to-market processes across domains like:
- Test And Product Engineering
- Package Design
- Qualification and Reliability Testing
- Yield Management
- Production Supply Chain Management
- SoC Design Competence for Shorter Time-to-Market
Silicon sub-systems and design methodologies assist clients minimize development efforts, costs, and time-to-market in the arenas of RF mixed signal integration in SoC, low-power SoC design and high performance SoC design.
With our solution offerings, we serve domains like industrial automation, short range wireless multimedia networks and devices, medical devices, and computing and consumer wireless peripherals.
To know more, write to us at vlsi@wipro.com